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Haze - A mass concentration of surface imperfections, often giving a hazy appearance to the wafer.
霧度?-?晶圓片表面大量的缺陷，常常表現(xiàn)為晶圓片表面呈霧狀。
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Hole - Similar to a positive charge, this is caused by the absence of a valence electron.
空穴?-?和正電荷類似，是由缺少價(jià)電子引起的。?
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Ingot - A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.
晶錠?-?由多晶或單晶形成的圓柱體，晶圓片由此切割而成。?
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Laser Light-Scattering Event - A signal pse that locates surface imperfections on a wafer.
激光散射?-?由晶圓片表面缺陷引起的脈沖信號。?
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Lay - The main direction of surface texture on a wafer.
層?-?晶圓片表面結(jié)構(gòu)的主要方向。?
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Light Point Defect (LPD) (Not preferred; see localized light-scatterer)
光點(diǎn)缺陷(LPD)?（不推薦使用，參見“局部光散射”）?
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Lithography - The process used to transfer patterns onto wafers.
光刻?-?從掩膜到圓片轉(zhuǎn)移的過程。?
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Localized Light-Scatterer - One feature on the surface of a wafer, such as a pit or a scratch that scatters light. It is also called a light point defect.
局部光散射?-?晶圓片表面特征，例如小坑或擦傷導(dǎo)致光線散射，也稱為光點(diǎn)缺陷。?
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Lot - Wafers of similar sizes and characteristics placed together in a shipment.
批次?-?具有相似尺寸和特性的晶圓片一并放置在一個(gè)載片器內(nèi)。?
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Majority Carrier - A carrier, either a hole or an electron that is dominant in a specific region, such as electrons in an N-Type area.
多數(shù)載流子?-?一種載流子，在半導(dǎo)體材料中起支配作用的空穴或電子，例如在N型中是電子。
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Mechanical Test Wafer - A silicon wafer used for testing purposes.
機(jī)械測試晶圓片?-?用于測試的晶圓片。?
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Microroughness - Surface roughness with spacing between the impurities with a measurement of less than 100 μm.
微粗糙?-?小于100微米的表面粗糙部分。?
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Miller Indices, of a Crystallographic Plane - A system that utilizes three numbers to identify plan orientation in a crystal.
Miller索指數(shù)?-?三個(gè)整數(shù)，用于確定某個(gè)并行面。這些整數(shù)是來自相同系統(tǒng)的基本向量。?
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Minimal Conditions or Dimensions - The allowable conditions for determining whether or not a wafer is considered acceptable.
最小條件或方向?-?確定晶圓片是否合格的允許條件。
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Minority Carrier - A carrier, either a hole or an electron that is not dominant in a specific region, such as electrons in a P-Type area.
少數(shù)載流子?-?在半導(dǎo)體材料中不起支配作用的移動電荷，在P型中是電子，在N型中是空穴。?
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Mound - A raised defect on the surface of a wafer measuring more than 0.25 mm.
堆垛?-?晶圓片表面超過0.25毫米的缺陷。?
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Notch - An indent on the edge of a wafer used for orientation purposes.
凹槽?-?晶圓片邊緣上用于晶向定位的小凹槽。?
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Orange Peel - A roughened surface that is visible to the unaided eye.
桔皮?-?可以用肉眼看到的粗糙表面?
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Orthogonal Misorientation -
直角定向誤差?-?
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Particle?-?A?small?p*不良詞語
*e of material found on a wafer that is not connected with it.
顆粒?-?晶圓片上的細(xì)小物質(zhì)。?
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Particle Counting - Wafers that are used to test tools for particle contamination.
顆粒計(jì)算?-?用來測試晶圓片顆粒污染的測試工具。?
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Particate Contamination - Particles found on the surface of a wafer. They appear as bright points when a collineated light is shined on the wafer.
顆粒污染?-?晶圓片表面的顆粒。?
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Pit - A non-removable imperfection found on the surface of a wafer.
深坑?-?一種晶圓片表面無法消除的缺陷。?
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Point Defect - A crystal defect that is an impurity, such as a lattice vacancy or an interstitial atom.
點(diǎn)缺陷?-?不純凈的晶缺陷，例如格子空缺或原子空隙。?
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Preferential Etch -
優(yōu)先蝕刻?-?
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Premium Wafer - A wafer that can be used for particle counting, measuring pattern resolution in the photolithography process, and metal contamination monitoring. This wafer has very strict specifications for a specific usage, but looser specifications than the prime wafer.
測試晶圓片?-?影印過程中用于顆粒計(jì)算、測量溶解度和檢測金屬污染的晶圓片。對于具體應(yīng)用該晶圓片有嚴(yán)格的要求，但是要比主晶圓片要求寬松些。?
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Primary Orientation Flat - The longest flat found on the wafer.
主定位邊?-?晶圓片上最長的定位邊。?
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Process Test Wafer - A wafer that can be used for processes as well as area cleanliness.
加工測試晶圓片?-?用于區(qū)域清潔過程中的晶圓片。?
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Profilometer - A tool that is used for measuring surface topography.
表面形貌劑?-?一種用來測量晶圓片表面形貌的工具。?
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Resistivity (Electrical) - The amount of difficulty that charged carriers have in moving throughout material.
電阻率（電學(xué)方面）?-?材料反抗或?qū)闺姾稍谄渲型ㄟ^的一種物理特性。?
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Required - The minimum specifications needed by the customer when ordering wafers.
必需?-?訂購晶圓片時(shí)客戶必須達(dá)到的最小規(guī)格。
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Roughness - The texture found on the surface of the wafer that is spaced very closely together.
粗糙度?-?晶圓片表面間隙很小的紋理。?
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Saw Marks - Surface irregarities
鋸痕?-?表面不規(guī)則。?
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Scan Direction - In the flatness calcation, the direction of the subsites.
掃描方向?-?平整度測量中，局部平面的方向。?
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Scanner Site Flatness -
局部平整度掃描儀?-?
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Scratch - A mark that is found on the wafer surface.
擦傷?-?晶圓片表面的痕跡。?
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Secondary Flat - A flat that is smaller than the primary orientation flat. The position of this flat determines what type the wafer is, and also the orientation of the wafer.
第二定位邊?-?比主定位邊小的定位邊，它的位置決定了晶圓片的類型和晶向。?
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Shape -
形狀?-?
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Site - An area on the front surface of the wafer that has sides parallel and perpendicar to the primary orientation flat. (This area is rectangar in shape)
局部表面?-?晶圓片前面上平行或垂直于主定位邊方向的區(qū)域。?
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Site Array - a neighboring set of sites
局部表面系列?-?一系列的相關(guān)局部表面。?
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Site Flatness -
局部平整?-?
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Slip - A defect pattern of small ridges found on the surface of the wafer.
劃傷?-?晶圓片表面上的小皺造成的缺陷。?
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Smudge - A defect or contamination found on the wafer caused by fingerprints.
污跡?-?晶圓片上指紋造成的缺陷或污染。?
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Sori -
Striation - Defects or contaminations found in the shape of a helix.
條痕?-?螺紋上的缺陷或污染。?
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Subsite, of a Site - An area found within the site, also rectangar. The center of the subsite must be located within the original site.
局部子表面?-?局部表面內(nèi)的區(qū)域，也是矩形的。子站中心必須位于原始站點(diǎn)內(nèi)部。?
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Surface Texture - Variations found on the real surface of the wafer that deviate from the reference surface.
表面紋理?-?晶圓片實(shí)際面與參考面的差異情況。?
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Test Wafer - A silicon wafer that is used in manufacturing for monitoring and testing purposes.
測試晶圓片?-?用于生產(chǎn)中監(jiān)測和測試的晶圓片。?
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Thickness of Top Silicon Film - The distance found between the face of the top silicon film and the surface of the oxide layer.
頂部硅膜厚度?-?頂部硅層表面和氧化層表面間的距離。?
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Top Silicon Film - The layer of silicon on which semiconductor devices are placed. This is located on top of the insating layer.
頂部硅膜?-?生產(chǎn)半導(dǎo)體電路的硅層，位于絕緣層頂部。?
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Total Indicator Reading (TIR) - The smallest distance between planes on the surface of the wafer.
總計(jì)指示劑數(shù)(TIR)?-?晶圓片表面位面間的最短距離。?
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Virgin Test Wafer - A wafer that has not been used in manufacturing or other processes.
原始測試晶圓片?-?還沒有用于生產(chǎn)或其他流程中的晶圓片。?
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Void?-?The?lack?of?any?sort?of?bond?(partic*不良詞語*arly?a?chemical?bond)?at?the?site?of?bonding.?
無效?-?在應(yīng)該綁定的地方?jīng)]有綁定（特別是化學(xué)綁定）。
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Waves - Curves and contours found on the surface of the wafer that can be seen by the naked eye.
波浪?-?晶圓片表面通過肉眼能發(fā)現(xiàn)的彎曲和曲線。?
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Waviness - Widely spaced imperfections on the surface of a wafer.
波紋?-?晶圓片表面經(jīng)常出現(xiàn)的缺陷。
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