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EchoProbe SOFTWARE反射探針軟件
setup of Recipes,Data logging,Real time Display
設(shè)置菜單，數(shù)據(jù)記錄，實(shí)時(shí)顯示
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EchoProbe SOFTWARE反射探針軟件
Programable Data Points and Patterns, Variety of Displays可控?cái)?shù)據(jù)點(diǎn)，模式，顯示種類(lèi)
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Presentation of Results結(jié)果陳列
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Advantages of Optical EchoProbe光學(xué)反射探針優(yōu)勢(shì)
?? Can measure Si or III/V wafers with or without tape, with Film frame, bumped wafers, bonded wafer - with Si or Glass or Sapphire carriers.可測(cè)量膠帶及Si或者III/V裸硅片，帶薄膜框架，凸起硅片，Si或者玻璃粘合硅片
?? Not affected by tape thickness, adhesives, pattern structures or non conducting materials不受膠帶厚度，粘合劑，圖案結(jié)構(gòu)或者不導(dǎo)電材料影響
?? Non contact technique非接觸技術(shù)
?? Fast- measurement speed快速測(cè)量
?? Extremely sensitive and stable method (demonstrated long term stability)極其靈敏和穩(wěn)定的方法（長(zhǎng)期穩(wěn)定性已證實(shí)）
Conclusion總結(jié)
? Very experienced Metrology company with an array of industry proven tools for wafer thickness measurement.
?? 經(jīng)驗(yàn)豐富的測(cè)量技術(shù)公司，硅片測(cè)量設(shè)備已經(jīng)被很多工業(yè)認(rèn)可
?? Provide measurement capability beyond Si, into III/V,and Quartz.測(cè)量技術(shù)涵蓋Si, III/V,石英
?? Provide a highly accurate Ultra-Thin wafer capability including 300 mm capability in a variety of platforms在一系列平臺(tái)上，提供高精確度的超薄硅片測(cè)量能力包括300mm
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