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Introduction to 128, 128L, 128LC2C Product Line for Film Stress Measurement
128 128L 128LC2C薄膜應(yīng)力測試產(chǎn)品簡介

128, 128L, 128C2C Product Line Introductions介紹
? Product Pictures產(chǎn)品圖片
? Basic principles of 128 Line? 128產(chǎn)品系列基本原理
? Film Stress薄膜應(yīng)力
? Dual laser scanner雙激光掃描
? Stoney equation for film stress薄膜應(yīng)力Stoney方程式
? Who needs the products?誰需要這種產(chǎn)品？
? Film property monitor and/or R&D薄膜性能監(jiān)測及研發(fā)
? What are the simple specifications?什么是基本參數(shù)？
? Film stress range / reproducibility薄膜應(yīng)力范圍/可再生性

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128 Film Stress and Flatness Measurement Models ( Room Temperature )
薄膜應(yīng)力和平整度測試設(shè)備（室溫）

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Film Stress & Wafer Yield薄膜應(yīng)力和硅片領(lǐng)域

What causes Film Stress ?什么導(dǎo)致了薄膜應(yīng)力？
When a thin film is deposited onto a substrate like a flat wafer - mechanical stress will be induced .
薄膜沉積到基板（比如說硅片平面）上時-會產(chǎn)生一個機(jī)械應(yīng)力。
This is exhibited as a wafer bow, where the film will be under tension / “Stress”
這樣會表現(xiàn)出一個硅片上的弓起，薄膜就會在張力和壓力下。

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How Residual Stress is created? 剩余應(yīng)力是如何產(chǎn)生的？

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Problems caused by Stress 應(yīng)力導(dǎo)致的問題
When induced stress exceeds the strength of the deposited film ....
如果產(chǎn)生的應(yīng)力超過了沉積薄膜的強(qiáng)度….

Cracking of deposited film沉積薄膜開裂
Delamination & Buckling of film stack薄膜堆棧分層&翹曲

Metallization hillocks金屬化小丘
Voids空隙
All lead to yield loss ($$$)這些導(dǎo)致?lián)p失

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Principle of Film Stress Measurement 薄膜應(yīng)力檢測原理

?Technology for FSM Stress and Wafer bow Measurements
應(yīng)力和硅片翹曲測量技術(shù)
Non Destructive Contactless Method
無損害非接觸式方法
Optilever laser scanning? (Patented) Optilever激光掃描（專利）

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Procedure for Thin Film Stress Measurement or Map 薄膜應(yīng)力檢測或映射步驟
1.?? Pre-Measure預(yù)檢測
Measure bare wafer surface profile(First Scan or Map )
裸露的硅片表面輪廓測量（第一次掃描或映射）
Deposit Thin Film淀積薄膜
2.?? Post-Measure后檢測
Measure surface profile after film deposition (Second Scan or Map )
薄膜淀積之后表面輪廓測量（第二次掃描或映射）?

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